Procurement of devices for a new Embedded AI lab - PCB assembly line
Procurement of a Small-to-Medium Scale Surface Mount Technology (SMT) Assembly Line for prototyping and small-scale manufacturing in the Embedded AI Lab. The equipment must be suitable for a High-Mix / Low-Volume environment.
CONTRACTING AUTHORITY
Name
Itä-Suomen yliopisto
Country
FI
CLASSIFICATION
Procedure Type
Open Procedure
Contract Type
Supplies
Main CPV
38000000, Laboratory, optical and precision equipments (excl. glasses).
ADDITIONAL DETAILS
Suitable for SMEs
Yes
Electronic Submission
Required
DEADLINES & TIMELINE
Submission Deadline
11 days remaining(LOT-0000)
Published