Fully Automatic Wire Bonder for Research and Development
Delivery of a fully automatic wire bonder: Installation, commissioning, and instruction in the operation of a brand-new system for research and development. The system must support wedge-wedge and ball-wedge bonding processes, precisely process aluminum and gold wires (12.5 to 32 µm diameter) as well as gold ribbons (35 to 50 µm width). Required features include fully automatic image recognition, real-time process monitoring, and programmable loop geometry for continuous operation in laboratory and development environments with high demands on precision, process stability, documentation, and reproducibility.
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- Portal — LOT-0001NON-RESTRICTED-DOCUMENT
- TED HTML — 591666-2026HTML
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- TED XML — 591666-2026XML
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