Etching System for Deep Silicon Etching for MEMS
Status
Active
Submission Deadline
31 days remaining
Contracting authority
Ruhr-Universität Bochum7 more open tenders view
Location
Bochum, Germany
Procedure
Competitive Dialogue · Supplies
Category
Laboratory, optical and precision equipments (excl. glasses).
Published
Reference
ted-562332-2026
Source
DRIE Etching System: For use in the Microelectronics Research Laboratory Bochum for wafer substrates up to 200 mm diameter, for deep anisotropic silicon etching (DRIE, "BOSCH process") in the field of silicon-based Micro-Electro-Mechanical Systems (MEMS), and for researching new etching concepts using less climate-damaging etching gases.
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Tender documents
- Portal — LOT-0001NON-RESTRICTED-DOCUMENT
- TED HTML — 562332-2026HTML
- TED PDF — 562332-2026PDF
- TED XML — 562332-2026XML
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Additional details
EU Funded
Yes
Suitable for SMEs
No
Electronic Submission
Required
Legal Basis
32014L0024