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Activeted-399697-2026

Etch System for High Aspect Ratios for 300mm Wafers

Procurement of a fully automated etch system for plasma etching processes on 300mm Silicon CMOS wafers in a cleanroom environment. The system is intended for structuring high aspect ratio components.

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CONTRACTING AUTHORITY

Name

Fraunhofer-Gesellschaft - Einkauf B12

City

München

Country

DE

CLASSIFICATION

Procedure Type

neg-w-call

Contract Type

Supplies

Main CPV

42990000, Miscellaneous special-purpose machinery.

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

No

Electronic Submission

allowed

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

34 days remaining

(LOT-0000)

Published

TENDER DOCUMENTS

34 days remaining

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