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Activeted-342514-2026

Automated Wet Tool for Wafer Photoresist Strip & Metal Etch

We are seeking a fully automated wet tool for wafer photoresist stripping and metal etching. This equipment is essential for semiconductor manufacturing processes.

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CONTRACTING AUTHORITY

Name

Fraunhofer-Gesellschaft, Einkauf B12

City

München

Country

DE

CLASSIFICATION

Procedure Type

neg-w-call

Contract Type

Supplies

Main CPV

31712100, Microelectronic machinery and apparatus.

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

No

Electronic Submission

allowed

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

29 days remaining

(LOT-0000)

Published

TENDER DOCUMENTS

29 days remaining

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