Chemical-Mechanical Polishing Machine
Status
Active
Submission Deadline
24 days remaining
Contracting authority
Friedrich-Schiller-Universität Jena3 more open tenders view
Location
Jena, Germany
Procedure
Open Procedure · Supplies
Category
Laboratory, optical and precision equipments (excl. glasses).
Published
Reference
ted-618476-2026
Source
Delivery of a chemical-mechanical polishing machine (CMP): for polishing semiconductor and dielectric surfaces for optical applications, suitable for sample sizes up to wafers (semiconductor discs) with diameters of up to 100 millimeters, capable of achieving roughnesses smaller than 1 nanometer (RMS roughness). Minimum requirements are listed in Annex 2. Offers exceeding a total contract value of 225,000.00 Euro net may be excluded.
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Tender documents
- Portal — LOT-0001NON-RESTRICTED-DOCUMENT
- TED HTML — 618476-2026HTML
- TED PDF — 618476-2026PDF
- TED XML — 618476-2026XML
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Additional details
EU Funded
Yes
Suitable for SMEs
No
Electronic Submission
Required
Legal Basis
32014L0024