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Activeted-344230-2026

CMP System for 100/150 mm Wafer

Procurement of a chemical-mechanical polishing system for 100/150 mm semiconductor wafers to planarize surfaces and improve roughness. This enables subsequent wafer fusion bonding of III-V semiconductors with Si wafers.

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CONTRACTING AUTHORITY

Name

Fraunhofer-Gesellschaft - Einkauf B12

City

München

Country

DE

CLASSIFICATION

Procedure Type

Open Procedure

Contract Type

Supplies

Main CPV

42900000, Miscellaneous general and special-purpose machinery.

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

Yes

Electronic Submission

allowed

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

21 days remaining

(LOT-0000)

Published

TENDER DOCUMENTS

21 days remaining

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