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Die-to-Wafer Bonder for Semiconductor Manufacturing
We are offering a state-of-the-art Die-to-Wafer Bonder, essential for precise connections in semiconductor manufacturing. This equipment enables the efficient production of microchips.
CONTRACTING AUTHORITY
CLASSIFICATION
Procedure Type
Open Procedure
Contract Type
Supplies
Main CPV
42990000, Miscellaneous special-purpose machinery.
ADDITIONAL DETAILS
Legal Basis
32014L0024
DEADLINES & TIMELINE
Submission Deadline
29 days remaining(LOT-0000)
Published