Wire Bonder for Semiconductor Components

Wire bonder for electrical contacting of semiconductor components: The wire bonder must be capable of producing several 10,000 bonds per day with optimal bond quality in fully automated production. Various components and circuit carriers are to be wire-bonded, especially semiconductor chips with metallized pads (pitch below 100 µm, pad size over 40 µm). The wire bonder operates non-destructively and does not contaminate substrates. Requirements are based on the attached specification; non-compliance is an exclusion criterion. Place of performance is Hahn-Schickard gGmbH, Allmandring 9b, 70569 Stuttgart. Alternative bids are not permitted. Execution period until November 30, 2026. Tender deadline is September 15, 2026, 12:00 PM; bid validity until October 31, 2026. A performance bond from a recognized German or European bank is required for the down payment until after delivery. Payment terms: 30% down payment after order, 60% after delivery, 10% after final acceptance and complete defect rectification. Required documents: self-declaration of insolvency freedom, proof of professional or liability insurance, self-declaration of compliance with the Wage and Minimum Wage Act and proper payment of taxes and social security contributions. Award criterion is economic efficiency, considering acquisition costs, projected energy costs over 10 years (calculated energy price 0.296 €/kWh), and other operating costs. Energy consumption must be proven by technical documents, manufacturer specifications, or standardized test procedures. further items as per the tender documents.

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