Edge-Handling Sputtering Cluster Tool for VTT Micronova
Status
Active
Submission Deadline
17 days remaining
Contracting authority
VTT Technical Research Centre of Finland Ltd5 more open tenders view
Location
Espoo, Finland
Procedure
Open Procedure · Supplies
Category
Laboratory, optical and precision equipments (excl. glasses).
Published
Reference
ted-548119-2026
Source
Delivery of an Edge-Handling Sputtering Cluster Tool: for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end; includes a deposition chamber with four magnetron sputtering sources; wafers are mechanically touched only at the wafer edge during transport and processing and can be flipped in vacuum between processes; further details as per the tender documents.
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Tender documents
- Portal — LOT-0000NON-RESTRICTED-DOCUMENT
- TED HTML — 548119-2026HTML
- TED PDF — 548119-2026PDF
- TED XML — 548119-2026XML
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Additional details
EU Funded
Yes
Suitable for SMEs
Yes
Electronic Submission
Required
Legal Basis
32014L0024