Flip Chip Die Bonder
Status
Active
Submission Deadline
25 days remaining
Contracting authority
FAIR - Facility for Antiproton and Ion Research in Europe GmbH3 more open tenders view
Location
Darmstadt, Germany
Procedure
Open Procedure · Supplies
Category
Laboratory, optical and precision equipments (excl. glasses).
Published
Reference
ted-582477-2026
Source
Delivery of a Flip Chip Die Bonder: precision die bonding (face up), flip chip bonding (face down), adapted system work table, chip and substrate heating with process gas enclosure, software-controlled bonding force module, ultrasonic bonding module, in-situ monitoring with video camera, form generator for creating reference elements for face up alignment, tool tip changing module, three different tool tips, tool tip support including heater, dispenser module for paste and liquids, UV-curing module, die-eject module.
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Tender documents
- Portal — LOT-0001NON-RESTRICTED-DOCUMENT
- TED HTML — 582477-2026HTML
- TED PDF — 582477-2026PDF
- TED XML — 582477-2026XML
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Additional details
EU Funded
Yes
Suitable for SMEs
Yes
Electronic Submission
Required
Legal Basis
32014L0024