Purchase of a Plasma Etching System for the West Saxon University of Applied Sciences Zwickau
We are seeking a state-of-the-art DRIE/RIE plasma etching system for precise processing of silicon wafers. The system must ensure detailed etching rates and endpoint detections for various materials and structures.
CONTRACTING AUTHORITY
Name
Westsächsische Hochschule Zwickau
City
Zwickau
Country
DE
CLASSIFICATION
Procedure Type
Open Procedure
Contract Type
Supplies
Main CPV
38000000, Laboratory, optical and precision equipments (excl. glasses).
Other CPV
42990000, Miscellaneous special-purpose machinery.
31712330, Semiconductors.
ADDITIONAL DETAILS
EU Funded
Yes
Suitable for SMEs
No
Electronic Submission
Required
Legal Basis
32014L0024
DEADLINES & TIMELINE
Submission Deadline
34 days remaining(LOT-0001)
Published