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Activeted-388383-2026

Purchase of a Plasma Etching System for the West Saxon University of Applied Sciences Zwickau

We are seeking a state-of-the-art DRIE/RIE plasma etching system for precise processing of silicon wafers. The system must ensure detailed etching rates and endpoint detections for various materials and structures.

CONTRACTING AUTHORITY

Name

Westsächsische Hochschule Zwickau

City

Zwickau

Country

DE

CLASSIFICATION

Procedure Type

Open Procedure

Contract Type

Supplies

Main CPV

38000000, Laboratory, optical and precision equipments (excl. glasses).

Other CPV

42990000, Miscellaneous special-purpose machinery.

31712330, Semiconductors.

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

No

Electronic Submission

Required

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

34 days remaining

(LOT-0001)

Published

TENDER DOCUMENTS

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