Activeted-535769-2026
Supply of an Ultrasonic Wire Bonding Machine for 12µm Cables
Supply of a new ultrasonic wire bonding machine: Enables ultrasonic welding with 12µm wires (compared to 25µm standard), with the capability for bonding 12µm, 25µm, and 75µm wires. The machine must support bonding from chips to packages or direct chip interconnection on 200mm plates, and allow for semi-automatic wire bonding.
CONTRACTING AUTHORITY
CLASSIFICATION
Procedure Type
Open Procedure
Contract Type
Supplies
Main CPV
31640000, Machines and apparatus with individual functions.
ADDITIONAL DETAILS
EU Funded
Yes
Electronic Submission
Required
Legal Basis
32014L0024
DEADLINES & TIMELINE
Submission Deadline
43 days remaining(LOT-0001)
Published