Measurement System for Synchronized Three-Dimensional Strain and Temperature Field Evaluations

Measurement system for synchronized three-dimensional strain and temperature field evaluations: two camera systems (3D measurement sensors) each with a minimum image resolution of 24 megapixels and an image rate of at least 100 images per second at full resolution; interfaces with a minimum 10GigE connection between cameras and measurement computer; flexible configuration for measurement field sizes between 20 mm and 5,000 mm width or height per measurement sensor; including interchangeable lenses, calibration objects, tripods, lighting, and adapters; synchronization of both 3D measurement sensors for deformation analyses on components over 5,000 mm and multi-sided structural analyses, connectable with thermography cameras and existing testing machine park; independent use of both 3D measurement sensors possible; two controllers and two powerful measurement computers in transport racks; option for photogrammetric geometry acquisition and generation of 3D point clouds; integration of recordings from an existing thermal imaging camera into the strain field analysis, synchronized processing with 24 megapixel cameras; complete delivery and commissioning by one provider; licenses for the operation of the two measurement computers and software licenses for image file evaluation; software with extensive features and user-friendliness; training for technical and scientific personnel; hardware-based synchronization with existing systems: servohydraulic testing machine with EDC580 control, HBK QuantumX MX840 for data acquisition, InfraTec ImageIR 8300 thermography camera; further items as per the tender documents.

Tender documents

Additional details