Plasma-Enhanced Atomic Layer Deposition (PE-ALD) System
Notice title: ALD-Anlage
Delivery of a Plasma-Enhanced Atomic Layer Deposition (PE-ALD) system for thin-film deposition on substrates ranging from single chip format (5 x 5 mm²) up to at least 150 mm wafers. The system must enable reproducible deposition processes for various conductive, semiconducting, and dielectric layers, also without vacuum interruption (multi-layers). A control PC with monitor, keyboard, mouse, software licenses, and Windows 11 operating system is to be supplied.
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Tender documents
- Portal — LOT-0001NON-RESTRICTED-DOCUMENT
- TED HTML — 589605-2026HTML
- TED PDF — 589605-2026PDF
- TED XML — 589605-2026XML
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