Activeted-386607-2026
Upgrade of a Tungsten CVD Chamber for High Aspect Ratio Gap-Fill
We are seeking an upgrade for an existing 200 mm Tungsten CVD system to enable pulsed deposition for High Aspect Ratio Gap-Fill applications. This includes hardware/software delivery, integration, commissioning, and adjustments for higher pressures.
CONTRACTING AUTHORITY
Name
IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
City
Frankfurt (Oder)
Country
DE
CLASSIFICATION
Procedure Type
neg-w-call
Contract Type
Supplies
Main CPV
42990000, Miscellaneous special-purpose machinery.
Other CPV
31712100, Microelectronic machinery and apparatus.
ADDITIONAL DETAILS
EU Funded
Yes
Suitable for SMEs
Yes
Electronic Submission
Required
Legal Basis
32014L0024
DEADLINES & TIMELINE
Submission Deadline
30 days remaining(LOT-0001)
Published