Wafer Prober / Frame Prober for Fraunhofer EMFT
Status
Active
Submission Deadline
28 days remaining
Contracting authority
Fraunhofer-Gesellschaft, Einkauf B1217 more open tenders view
Location
München, Germany
Procedure
Open Procedure · Supplies
Category
Electrical machinery, apparatus, equipment and consumables; Lighting.
Published
Reference
ted-550859-2026
Source
Wafer prober system: Use for post-silicon verification, characterization, and functional testing of integrated circuits and chiplets at Fraunhofer EMFT. The system must be capable of handling 200mm and 300mm wafers, as well as wafers mounted on a dicing frame (frame prober function), and will be coupled with an automated test system (ATE).
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Tender documents
- Portal — LOT-0000NON-RESTRICTED-DOCUMENT
- TED HTML — 550859-2026HTML
- TED PDF — 550859-2026PDF
- TED XML — 550859-2026XML
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Additional details
EU Funded
Yes
Suitable for SMEs
No
Electronic Submission
Allowed
Legal Basis
32014L0024