200 mm Wafer Prober including Temperature Testing

Delivery of a 200 mm Wafer Prober: 1 piece, including temperature testing, for characterization and test engineering for sensor ICs and chiplets at Fraunhofer IIS. The system must handle 200 mm and 300 mm wafers and 300 mm dicing frames. The focus is on probing accuracy and the possibility for stimulation of optical and magnetic sensors; a darkened DuT chamber is mandatory for optical sensors. The Wafer Chuck must be made of non-magnetic materials. Options include: Wafer Chuck ATT Dry Air control, Wafer Chuck High Voltage Preparation, Loading OCR-Reader Top-Side, Loading Wafer ID-Reading for text with standard and non-standard fonts, Barcode and QR-Code, electrical interface and remote control for remote control of the prober system, and a GPIB interface (IEEE-488).

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