300 mm D2W Hybrid Bonding Tool

Supply of a 300 mm D2W Hybrid Bonding Tool: 1 unit for automated D2W bonding for heterogeneous 2.5D/3D QMI and chiplet integration, enabling interconnection with +/- 200 nm accuracy on 300 mm wafers. The equipment performs the following process steps: automated loading and unloading of wafers from 12-inch tape frame cassettes and 12-inch wafers from wafer FOUPs; wafer and tape-frame ID readout; automated feeding of wafers onto the chuck and tape frames into the bonding unit; pick-up of dies (components) from the tape frame, optional flip, and precise bonding onto wafer or die. Programming and operation must be possible within an appropriate range of options and parameters as required for research and development.

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