Skip to main content
Back
Activeted-509581-2026

Electrical measurement modules: Oscilloscope, SourceMeter, LCRMeter, ElectricalSwitchMatrix and multi-measurement control

Supply of electrical measurement modules: Oscilloscope, SourceMeter, LCRMeter, ElectricalSwitchMatrix, and multi-measurement control.

View original source

CONTRACTING AUTHORITY

Name

Fraunhofer-Gesellschaft - Einkauf B12

City

München

Country

DE

Website

CLASSIFICATION

Procedure Type

Open Procedure

Contract Type

Supplies

Main CPV

38341300, Instruments for measuring electrical quantities.

Other CPV

38342000, Oscilloscopes.

38552000, Electronic meters.

38342000, Oscilloscopes.

38552000, Electronic meters.

LOTS (2)

LOT-0001Supplies

Oszilloskop, SourceMeter, LCRMeter, ElectricalSwitchMatrix

LOT-0002Supplies

Steuerung für Mehrfachmessungen

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

No

Electronic Submission

allowed

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

23 days remaining

(LOT-0001)

Published

Download tender documentsDemo required

TENDER DOCUMENTS

Portal — LOT-0001

NON-RESTRICTED-DOCUMENT

Demo required

TED HTML — 509581-2026

HTML

Demo required

TED PDF — 509581-2026

PDF

Demo required

TED XML — 509581-2026

XML

Demo required
23 days remaining

Similar Tenders

Explore CPV 38

300 mm D2W Hybrid Bonding Tool

Supply of a 300 mm D2W Hybrid Bonding Tool: 1 unit for automated D2W bonding for heterogeneous 2.5D/3D QMI and chiplet integration, enabling interconnection with +/- 200 nm accuracy on 300 mm wafers. The equipment performs the following process steps: automated loading and unloading of wafers from 12-inch tape frame cassettes and 12-inch wafers from wafer FOUPs; wafer and tape-frame ID readout; automated feeding of wafers onto the chuck and tape frames into the bonding unit; pick-up of dies (components) from the tape frame, optional flip, and precise bonding onto wafer or die. Programming and operation must be possible within an appropriate range of options and parameters as required for research and development.

Fraunhofer-Gesellschaft - Einkauf B12

·München
Deadline:September 01, 2026

Fiber Channel Switch

Delivery of a Fiber Channel Switch.

Fraunhofer-Gesellschaft - Einkauf B12

·EMI Fraunhofer-Institut Kurzzeitdynamik Ernst-Zermelo-Str. 4 79104 Freiburg
Deadline:August 31, 2026

FIB-SEM Dual-Beam System

FIB-SEM Dual-Beam System: 1 unit field-free (without immersion optics) focused ion beam system combined with a high-resolution scanning electron microscope for patterning, nanostructuring, and cross-sectional and surface analysis of primarily III/V semiconductors, LNOI, polymers, resists, and semiconductor technology process products. Programmable and automated routines should be configurable. Options: advanced training course for 15 days (2 people), availability to be confirmed as required; 1 gas injection system with additional components, to be specified in the tender; software module for importing KLAF files.

Fraunhofer-Gesellschaft - Einkauf B12

·München
Deadline:August 17, 2026

D2W Bonder

Delivery of a D2W Bonder: 1 piece.

Fraunhofer-Gesellschaft - Einkauf B12

·München
Deadline:September 01, 2026

Find matching tenders automatically

With Patterno-HIT, receive relevant tenders daily, automatically filtered to your company profile.

Book Demo Now