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Activeted-434171-2026

Die-to-Wafer Bonder for Fraunhofer-Gesellschaft

We are seeking one Die-to-Wafer Bonder for Fraunhofer-Gesellschaft, including options for extended warranty and specific wafer/chiplet handling capabilities, with SECS-GEM command control.

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CONTRACTING AUTHORITY

Name

Fraunhofer-Gesellschaft - Einkauf B12

City

München

Country

DE

CLASSIFICATION

Procedure Type

Open Procedure

Contract Type

Supplies

Main CPV

42990000, Miscellaneous special-purpose machinery.

ADDITIONAL DETAILS

EU Funded

Yes

Suitable for SMEs

No

Electronic Submission

allowed

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

28 days remaining

(LOT-0000)

Published

TENDER DOCUMENTS

28 days remaining

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