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Automatic Metal CMP System with Wafer Cleaner for 200mm Semiconductor Wafers

Procurement of an automatic metal CMP system with an integrated wafer cleaner for processing and planarization of 200mm semiconductor wafers, including delivery, installation, and commissioning.

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CONTRACTING AUTHORITY

Name

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Country

FI

CLASSIFICATION

Procedure Type

neg-wo-call

Contract Type

Supplies

Main CPV

38000000, Laboratory, optical and precision equipments (excl. glasses).

ADDITIONAL DETAILS

Electronic Submission

Required

Legal Basis

32014L0024

DEADLINES & TIMELINE

Submission Deadline

184 days remaining

(LOT-0000)

Published

184 days remaining

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