Laser Micromachining System and Laser System

Delivery, installation, commissioning, and ready-for-operation handover of a high-precision laser processing system for micromaterial processing, including an integrated ultrashort pulse laser (UKP) beam source, operator training, and complete system documentation. The system enables high-precision processing of metallic, ceramic, polymeric, glass-based, crystalline, and semiconductor materials, as well as fiber composites, in the micro- and submicrometer range. Applications include microstructuring, micromaterial processing, structuring of functional materials, processing of brittle-hard materials, structuring of polymeric materials and composites, microdrilling, microcutting, selective material removal, precise surface modification and functionalization, synchronous, simultaneous 5-axis processing of complex geometries, and high-precision sample preparation. The working area must allow processing of samples with lateral dimensions of at least approx. 300 mm × 300 mm, accommodate a maximum sample height of at least 50-100 mm, and a maximum sample mass of at least 6 kg. Core functions include a laser source with a fundamental wavelength of 1064 nm or 1030 nm (IR) with frequency conversion stages for SHG (VIS) and THG (UV), precise laser structuring (2D, 2.5D/3D, deep structuring) using a 2-axis galvanometer scanner, synchronous, simultaneous 5-axis processing, monitoring, analysis, and documentation of processes, a suitable clamping and process environment, and efficient, reproducible, and automatable process control with software and interface solutions. A highly rigid support system, e.g., granite portal, is required.

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